PCB trace width for current capacity (IPC-2221) across copper weights and temperature rises.
Updated Apr 19, 20262 min read
External (outer) layer figures — doubled for internal layers because no air cooling. All values at 1 oz copper, 25 °C ambient.
10 °C rise
Current
0.5 oz
1 oz
2 oz
1 A
20 mil
10 mil
5 mil
2 A
50 mil
25 mil
13 mil
3 A
90 mil
45 mil
23 mil
5 A
180 mil
90 mil
45 mil
10 A
450 mil
225 mil
113 mil
15 A
800 mil
400 mil
200 mil
20 °C rise
Current
0.5 oz
1 oz
2 oz
1 A
15 mil
7 mil
4 mil
2 A
35 mil
18 mil
9 mil
3 A
60 mil
30 mil
15 mil
5 A
120 mil
60 mil
30 mil
10 A
300 mil
150 mil
75 mil
30 °C rise
Current
0.5 oz
1 oz
2 oz
1 A
12 mil
6 mil
3 mil
2 A
25 mil
13 mil
7 mil
3 A
45 mil
23 mil
12 mil
5 A
100 mil
50 mil
25 mil
10 A
240 mil
120 mil
60 mil
Notes
IPC-2221 formula: I = k · ΔT^0.44 · A^0.725 where A = trace CSA in mil², k = 0.048 (external) / 0.024 (internal).
Design for the lowest expected ambient and worst-case current. Add pours / copper fills around power traces for spreading.
Convert: 1 oz copper ≈ 1.37 mil / 35 µm thick.
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