Passive SMD (imperial / metric)
| Imperial | Metric | Size (L × W mm) | Use |
|---|---|---|---|
| 0201 | 0603 | 0.6 × 0.3 | Dense RF, tiny |
| 0402 | 1005 | 1.0 × 0.5 | General purpose |
| 0603 | 1608 | 1.6 × 0.8 | Hand-solderable small |
| 0805 | 2012 | 2.0 × 1.25 | Most common hobby size |
| 1206 | 3216 | 3.2 × 1.6 | High power / voltage |
| 1210 | 3225 | 3.2 × 2.5 | High-C ceramics |
| 1812 | 4532 | 4.5 × 3.2 | High power / inductor |
Through-hole IC
| Package | Pin pitch | Notes |
|---|---|---|
| DIP-8 / 14 / 16 / 20 / 28 / 40 | 2.54 mm | Dual in-line, breadboard-friendly |
| TO-92 | — | 3-lead transistor |
| TO-220 | — | Tab transistor, ≤ ~75 W |
| TO-247 / TO-3 | — | High-power |
Surface-mount IC
| Package | Pin pitch | Notes |
|---|---|---|
| SOT-23 | 0.95 mm | 3–8 pin transistors/regs |
| SOIC | 1.27 mm | "Small outline" DIP-equivalent |
| SSOP / TSSOP | 0.65 mm | Shrink outline |
| QFP / TQFP | 0.5–0.8 mm | Leaded quad flat |
| QFN / DFN | 0.5 mm | Leadless — pads under the body |
| BGA | 0.4–1.0 mm | Ball grid array — needs reflow oven |
| LGA | 0.5 mm | Land grid — CPUs, sockets |
| WLCSP | 0.3–0.5 mm | Wafer-level chip-scale |
Notes
- Solder-iron hand-soldering: 0603 and larger, SOIC, QFP ≥0.65 mm pitch (use flux and wick).
- Reflow / hot-air required for QFN, BGA, and <0.65 mm pitch QFP.
- Imperial 0201 ≠ metric 0201 — metric 0201 is actually 0.25 × 0.125 mm, even smaller than imperial 0201.
Was this article helpful?