Electronics

PCB Design Rules

Common PCB fabrication constraints — trace width, clearance, via sizes, and IPC classes.

Typical hobby / prototype rules

RuleCheap fabStandardHigh-tech
Min trace width6 mil (0.15 mm)5 mil3 mil
Min trace clearance6 mil5 mil3 mil
Min annular ring6 mil5 mil3 mil
Min drill hole0.3 mm0.2 mm0.1 mm laser
Min via diameter0.6 mm0.5 mm0.3 mm
Copper weight1 oz1 oz2+ oz
Board thickness1.6 mm1.6 mm0.4–3.2 mm
Minimum finished hole0.3 mm0.2 mm0.1 mm

IPC classes

Class 1General electronics — consumer, no-mission-critical
Class 2Dedicated-service / industrial — long service life, uninterrupted operation expected
Class 3High-reliability — medical, aerospace, life support

Current vs trace width (1 oz copper, 10 °C rise)

CurrentExternal layerInternal layer
1 A10 mil30 mil
2 A25 mil70 mil
5 A90 mil250 mil
10 A225 mil650 mil

Rules of thumb

  • Keep high-speed digital traces as short as possible with continuous ground reference under them.
  • 45° or rounded corners (no 90° bends) on high-speed signals reduce reflections.
  • Decoupling caps close to the IC pin — short trace to GND plane.
  • Differential pairs: length-match within ~5% of rise time; keep the pair spacing constant.
  • Avoid split ground planes under signals that cross the split.
Was this article helpful?