Electronics

Thermal Cheat Sheet

Quick reference for thermal-resistance, dissipation, and heatsink selection.

Core equation

Heat flowΔT = P · R_θ (analogous to V = IR)
Junction tempT_J = T_A + P · (R_θJC + R_θCS + R_θSA)
DeratingTarget T_J ≤ 0.8 × T_J,max

Approximate heat transfer coefficients (W/m²·K)

Mechanismh
Natural convection (air)5 – 25
Forced convection (air)10 – 500
Natural convection (water)50 – 1 000
Forced convection (water)300 – 12 000
Boiling water2 500 – 25 000
Radiation (painted matte)5 – 10 (at 300 K)

Heatsink rules of thumb

  • Orient fins vertically for natural convection.
  • Leave 25 mm clearance above/below fins.
  • Black-anodize fins for +10–15% radiative boost over bare aluminum.
  • Forced air (small fan) typically halves R_θSA.
  • Heat pipe inside bigger sinks spreads heat from the die footprint across the full fin area.
  • TIM: use just enough to wet the surface — excess increases resistance.

Ballpark TO-220 dissipation

SetupR_θJASafe P @ 25 °C ambient
No sink~60 °C/W~1.5 W
Small clip sink~20 °C/W~4 W
Medium extruded~8 °C/W~11 W
Large + fan~3 °C/W~30 W
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