Common Electronics Packages

Through-hole and SMD package reference — dimensions and typical use.

Reference Reference Updated Apr 19, 2026

Imperial	Metric	Size (L × W mm)	Use
0201	0603	0.6 × 0.3	Dense RF, tiny
0402	1005	1.0 × 0.5	General purpose
0603	1608	1.6 × 0.8	Hand-solderable small
0805	2012	2.0 × 1.25	Most common hobby size
1206	3216	3.2 × 1.6	High power / voltage
1210	3225	3.2 × 2.5	High-C ceramics
1812	4532	4.5 × 3.2	High power / inductor

Package	Pin pitch	Notes
DIP-8 / 14 / 16 / 20 / 28 / 40	2.54 mm	Dual in-line, breadboard-friendly
TO-92	—	3-lead transistor
TO-220	—	Tab transistor, ≤ ~75 W
TO-247 / TO-3	—	High-power

Package	Pin pitch	Notes
SOT-23	0.95 mm	3–8 pin transistors/regs
SOIC	1.27 mm	"Small outline" DIP-equivalent
SSOP / TSSOP	0.65 mm	Shrink outline
QFP / TQFP	0.5–0.8 mm	Leaded quad flat
QFN / DFN	0.5 mm	Leadless — pads under the body
BGA	0.4–1.0 mm	Ball grid array — needs reflow oven
LGA	0.5 mm	Land grid — CPUs, sockets
WLCSP	0.3–0.5 mm	Wafer-level chip-scale

Notes

Solder-iron hand-soldering: 0603 and larger, SOIC, QFP ≥0.65 mm pitch (use flux and wick).
Reflow / hot-air required for QFN, BGA, and <0.65 mm pitch QFP.
Imperial 0201 ≠ metric 0201 — metric 0201 is actually 0.25 × 0.125 mm, even smaller than imperial 0201.

Last updated: April 19, 2026