Heatsink Calculator

Required heatsink thermal resistance (Rθsa) for a given die.

Calculator Electronics Updated Apr 18, 2026
How to Use
  1. Enter Pd, Tj,max, Ta, Rθjc and Rθcs.
  2. Needed Rθsa = (Tj − Ta)/P − Rθjc − Rθcs.
Input
W
°C
°C
°C/W
°C/W
Presets
Thermal Chain
Rθsa needed
ΔT total
Tc (case)
Ts (sink)

Show Work

Enter values to see the thermal budget.

Formulas

Required Sink R
RθSA = (Tj−Ta)/P − RθJC − RθCS
Pick sink with lower RθSA.
Temperature Drop
ΔT = P × Rθ
Analogous to Ohm\'s law (V = IR).
Total RθJA
RθJC + RθCS + RθSA
Series thermal chain.
TIM Contribution
~0.1–1 °C/W
Thermal interface material.
Natural Convection
~5–15 °C/W
Still air, finned heatsink.
Forced Air
~1–5 °C/W
Fan or blower.

History of Heat Sinking

Thermal management of semiconductor devices became a formal engineering discipline in the 1950s as the first germanium and silicon power transistors shipped. Early power devices in TO-3 metal cans were screw-mounted directly to chassis; the chassis itself was the heatsink. Extruded aluminum fin-stock heatsinks appeared in the 1960s, and TIM (thermal interface materials) — silicone grease, later graphite pads, and then phase-change materials — evolved alongside to fill microscopic air gaps between mating surfaces.

The thermal-resistance model (Rθ in °C/W, added in series like electrical resistances) was formalized by the Electronic Industries Association (EIA) in the 1970s and remains the primary analytical tool used in datasheets and design guides today. Its elegance: each stage of the path from junction to ambient can be characterized independently (junction-to-case, case-to-sink, sink-to-ambient) and summed, giving a simple additive calculation for the full thermal chain.

Modern high-power electronics — GPUs, EV motor drives, photovoltaic inverters — push heatsinks into active cooling territory. Direct liquid cooling (cold plates bolted to the package lid), vapor chambers (heat pipes with wick+fluid+fin), and even phase-change immersion cooling are now standard for 300+ W applications. The humble fin-stock extrusion persists for everything up to ~50 W continuous dissipation.

About This Calculator

Enter the power dissipated, target maximum junction temperature (usually 85°C below Tj,max for reliability margin), ambient air temperature, junction-to-case thermal resistance RθJC (from datasheet), and case-to-sink resistance RθCS (TIM — typically 0.1–1 °C/W). The tool returns the required heatsink thermal resistance RθSA — pick a heatsink with equal or lower rating.

For natural convection in still air, typical finned heatsinks deliver 5–15 °C/W. Add a fan to drop into the 1–5 °C/W range. If RθSA needed is below 1 °C/W, consider liquid cooling or direct die-cooling techniques. Everything runs client-side; no values leave your browser.

Frequently Asked Questions

Units?

Thermal resistance in °C/W.

Derate?

Keep Tj ≥20 °C below rated max for reliability.

Common Use Cases

Linear Reg

LM78xx dissipating 10 W.

MOSFET

Pick sink for switching loss.

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